MIL-PRF-19500/509D
4.4.2.2 Group B inspection, table E-VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
*
Method
Condition
Subgroup
B3
2037
Test condition A, all internal leads for each device shall be pulled separately.
For solder die attach: VCE ≥ 20 V dc, 2,000 cycles.
B3
1037
For eutectic die attach: VCE ≥ 20 V dc adjust PT to achieve TJ = +175°C minimum.
B3
1027
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
*
4.4.3.1 Group C inspection, table E-VII of MIL-PRF-19500.
Method
Condition
Subgroup
C2
2036
Test condition A; weight = 10 pounds.; time = 15 s.
*
C5
3131
Thermal resistance, see 4.5.2.
For solder die attach: VCE ≥ 20 V dc, 6,000 cycles.
C6
1037
For eutectic die attach: VCE ≥ 20 V dc, adjust PT to achieve TJ = +175°C minimum.
C6
1027
* 4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follow:
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
* 4.5.2 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with test method
3131 of MIL-STD-750 using the guide lines in that method for determining IM, IH, tH, and tsw. The maximum limit for
RθJC shall be 0.875°C/W.
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