MIL-PRF-19500/515D
* 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurements
of MIL-PRF-19500)
JANTX, JANTXV levels
(1) 3c
Thermal impedance (see 4.3.3).
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ICEX1 and hFE2
12
See 4.3.2, method 1039 of MIL-STD-750, test condition B.
13
Subgroup 2 of table I herein;
ĆICEX1 = 100 percent of initial value or 2 µA dc, whichever is
greater.
ĆhFE2 = ± 25 percent of initial value.
(1)
Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
* 4.3.1 Screening (JANHC) die. Screening of JANHC die shall be in accordance with appendix G of
MIL-PRF-19500. As a minimum, die shall be 100 percent probed to insure the assembled chips will meet the
requirements of table I, subgroup 2.
* 4.3.2 Power burn-in conditions. Power burn-in conditions are TJ = + 187.5 °C, ± 12.5 °C; VCB ≥ 20 V dc;
TA ≤ +35°C. TJ measurement shall be in accordance with method 3100 of MIL-STD-750.
* 4.3.3 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 µs max. See table III, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with subgroup 2 of table I herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Electrical measurements (end-
points) shall be in accordance with subgroup 2 of table I herein. Delta measurements shall be in accordance with
table II herein.
Method
Condition
Subgroup
For solder die attach: VCE ≥ 20 V dc, 2,000 cycles.
B3
1037
For eutectic die attach: VCE ≥ 20 V dc adjust PT to achieve TJ = +175°C
B3
1027
minimum.
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