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MIL-PRF-19500-523 Semiconductor Device, Transistor, Npn, Silicon, Power Darlington Types 2N6383, 2N6384, 2N6385, Jan, Jantx, And JantxvThis specification covers the performance requirements for NPN silicon, power Darlington transistors. Three levels of product assurance are provided for each device type as specified in MIL–PRF–19500.

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MIL­PRF­19500/523D
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E­IV of
MIL­PRF­19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E­IV
Measurement
JANTX and JANTXV levels only
3c (1)
Thermal impedance, see 4.3.1
ICEX1 and hFE1
11
12
See 4.3.2
13
See table I, subgroup 2 herein.
ĆICEX1 = 100 percent of initial value or 10 µA dc, whichever is greater.
ĆhFE1 = ±25 percent of initial value.
(1) Thermal impedance shall be performed anytime after temperature cycling (screen 3a) and does not need to
be repeated in screening requirements.
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with test
method 3131 of MIL­STD­750 using the guidelines in that method for determining IM, IH, tH, tSW, tMD (and VH where
appropriate). The thermal impedance limit used in screen 3c and table I, subgroup 2 herein shall be set statistically
by the supplier. See table II, subgroup 4 (group E) herein.
4.3.2 Power burn-in conditions. The power burn-in conditions shall be as follows: TJ = +162.5°C ±12.5°C. The
following details shall apply:
VCB = 30 V dc for device type 2N6383.
a.
b.
VCB = 40 V dc for device type 2N6384.
c.
VCB = 60 V dc for device type 2N6385.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL­PRF­19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E­V of
MIL­PRF­19500 and table I herein. Electrical measurements (end-points) shall be in accordance with table I,
subgroup 2 herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table E­VIB (JAN, JANTX, and JANTXV) of MIL­PRF­19500 and as follows.
Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
Subgroup
Method
Conditions
Intermittent operation life, for solder die attach: VCB ≥ 10 V dc, 2,000 cycles,
B3
1037
TA ≤ +35°C.
Steady state life, 340 hours, for eutectic die attach: VCB ≥ 10 V dc, TA ≤ +35°C
B3
1027
adjust PT to achieve TJ = +150°C minimum.
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