MIL-PRF-19500-540 Semiconductor Device, Darlington Transistor, Pnp Silicon, Power, Types 2N6298 And 2N6299, Jan, Jantx, And JantxvThis specification covers the performance requirements for PNP, Darlington, silicon, power transistors. Three levels of product assurance is provided for each device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/540F

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4 and tables I and II).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as

specified herein.

4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In

case qualification was awarded to a prior revision of the specification sheet that did not request the performance of

table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on

the first inspection lot of this revision to maintain qualification.

* 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of

MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I

herein. Devices that exceed the limits of table I herein shall not be acceptable.

Screen (see table E-IV

Measurements

JANTX and JANTXV levels only

Thermal impedance (see 4.3.2).

(1) 3c

ICEX1 and hFE2

Subgroup 2 of table I herein;

ĆICEX1 = 100 percent of initial value or

-2 �A dc, whichever is greater.

ĆhFE2 = �40 percent.

(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to

be repeated in screening requirements.

* 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCE ≥ -10 V dc; TJ = +162.5�C �12.5�C.

NOTE: No heat sink or forced air cooling on the devices shall be permitted.

4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with

method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (and VH where

appropriate). See table II, group E, subgroup 4 herein. Measurement delay time (tMD) = 70 �s max.

4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.

4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of

MIL-PRF-19500 and table I herein. Electrical measurements (end-points) shall be in accordance with table I,

subgroup 2 herein.