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MIL-PRF-19500-558 Semiconductor Device, Unitized, Pnp, Silicon, Switching, Four Transistor Array, Types 2N6987, 2N6987U, And 2N6988, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, And JanshThis specification covers the performance requirements for PNP, silicon, switching transistors, four independent chip array. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/558J

Symbol

Inches

Millimeters

Notes

Min

Max

Min

Max

.200

5.08

.014

.023

0.36

0.58

LW1

.030

.070

0.76

1.78

4, 8

.008

.015

0.20

0.38

.785

19.94

.220

.310

5.59

7.87

BW1

.290

.320

7.37

8.13

.100 BSC

2.54 BSC

5, 9

.125

.200

3.18

5.08

LL1

.150

3.81

LO2

.015

.060

0.38

1.52

LO1

.098

2.49

.005

0.13

0�

15�

0�

15�

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for information only.

3. Index area; a notch or pin one identification mark shall be located adjacent to pin one and shall be

located within the shaded area shown. The manufacturer's identification shall not be used as a pin one

identification mark.

4. The minimum limit for dimension LW1 may be .023 inch (0.58 mm) for lead numbers 1, 7, 8, and 14 only.

5. Dimension LO2 shall be measured from the seating plane to the base plane.

6. This dimension allows for off-center lid, meniscus, and glass overrun.

7. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be

located within �.010 inch (�0.25 mm) of its exact longitudinal position relative to pins 1 and 14.

8. Applies to all four corners (lead numbers 1, 7, 8, and 14).

9. Lead center when α is 0 degrees. BW1 shall be measured at the centerline of the leads.

10. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the center of the flat, when

lead finish A is applied. Pointed or round lead ends are allowed.

11. Twelve spaces.

12. No organic or polymeric materials shall be molded to the bottom of the package to cover leads.

13. For terminal connections, see figure 4.

14. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.

FIGURE 1. Dimensions and configuration for type 2N6987 - Continued.