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MIL-PRF-19500-558 Semiconductor Device, Unitized, Pnp, Silicon, Switching, Four Transistor Array, Types 2N6987, 2N6987U, And 2N6988, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, And JanshThis specification covers the performance requirements for PNP, silicon, switching transistors, four independent chip array. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14

MIL-PRF-19500/558J

Dimensions

Symbol

Inches

Millimeters

Notes

Symbol

Inches

Millimeters

Notes

Min

Max

Min

Max

Min

Max

Min

Max

.030

.115

0.76

2.92

BW3

.030

0.76

.010

.019

0.25

0.48

.050 BSC

1.27 BSC

6, 8

.008

.015

0.20

0.38

.003

.006

0.076

0.152

.280

7.11

.250

.370

6.35

9.40

.240

.260

6.10

6.60

LD2

.005

.040

0.13

1.02

.290

7.37

.005

0.13

9, 10

BW2

.125

3.18

LO3

.004

0.10

30�

90�

30�

90�

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. Index area: A notch or pin one identification mark shall be located adjacent to pin one and shall be located

within the shaded area shown. The manufacturer's identification shall not be used as a pin one

identification mark. Alternatively, a tab (dim TL) may be used to identify pin one.

4. Dimension LD2 shall be measured at the point of exit of the lead from the body.

5. This dimension allows for off-center lid, meniscus, and glass overrun.

6. The basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located

within �.005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 14.

7. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the center of the flat when the lead

finish is solder.

8. Twelve spaces.

9. Applies to all four corners (leads number 2, 6, 9, and 13).

10. Dimension LO may be .000 inch (0.00 mm if leads number 2, 6, 9, and 13) bend toward the cavity of the

package within one lead width from the point of entry of the lead into the body or if the leads are brazed to

the metallized ceramic body.

11. No organic or polymeric materials shall be molded to the bottom of the package to cover the leads.

12. Optional, see note 1. If a pin one identification mark is used in addition to this tab, the minimum limit of

dimension TL does not apply.

13. Applies to leads number 1, 7, 8, and 14.

14. Lead configuration is optional within dimension BW except dimensions LW and LT apply.

15. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.

16. Pins 1, 7, 8, and 14 are collectors.

17. Pins 2, 6, 9, and 13 are bases.

18. Pins 3, 5, 10, and 12 are emitters.

19. Pins 4 and 11 are no contacts.

FIGURE 2. Physical dimensions for type 2N6988 - Continued.