MIL-PRF-19500/580C
* 4.3 Screening (list applicable JAN levels). Screening shall be in accordance with table IV of MIL-PRF-19500 and
as specified herein. The following measurements shall be made in accordance with table I herein. Devices that
exceed the limits of table I herein shall not be acceptable.
Screen (see appendix E,
Measurement
table IV of MIL-PRF-19500)
JANTX and JANTXV level only
(1) 3c
Method 3131 (see 4.5.2)
11
ICBO, and hFE2
12
See 4.3.1.
13
Subgroup 2 of table I herein
ĆICBO = 100 percent of initial value, or
-10 nA dc whichever is greater;
ĆhFE2 = ± 15percent of initial value.
(1) Shall be performed anytime before screen 10.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = -10 - -30 V dc; power shall be
applied to achieve TJ + 135°C minimum and minimum power dissipation of PD = 75 percent of maximum rated PT as
defined in 1.3. With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias
conditions, TJ, and mounting conditions) may be used. A justification demonstrating equivalence is required. In
addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in
modification approval. This optional is limited to plants who are at least transitional (QML) approved or have an
approved technical review board (TRB).
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD (and VC where
appropriate). The thermal impedance limit used in screen 3c of 4.3 herein and subgroup 2 of table I shall comply with
the thermal impedance graph in figures furnished by the manufacturer (less than or equal to the curve value at the
same tH time) and shall be less than the process determined statistical maximum limit as outlined in method 3131.
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