MIL-PRF-19500/580C
* 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened
devices shall be submitted to and pass the requirements of group A1 and A2 inspection only (table VIC, group B,
subgroup 1 is not required to be performed again if group B has already been satisfied in accordance with 4.4.2).
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of
MIL-PRF-19500. End-point electrical measurements shall be in accordance with table II herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table VIC (JAN, JANTX and JANTXV) of MIL-PRF-19500, and herein. Electrical
measurements (end-points) and delta requirements shall be after each step in 4.4.2.1 and shall be in accordance with
* 4.4.2.1 Group B inspection, appendix E, table VIC (JAN, JANTX and JANTXV) of MIL-PRF-19500. Separate
samples may be used for each step. In the event of a lot failure, the resubmission requirements of MIL-PRF-19500
shall apply. In addition, all catastrophic failures during CI shall be analyzed to the extent possible to identify root
cause and corrective action. Whenever a failure is identified as wafer lot and /or wafer processing related, the entire
wafer lot and related devices assembled from the wafer lot shall be rejected unless an appropriate determined
corrective action to eliminate the failures mode has been implemented and the devices from the wafer lot are
screened to eliminate the failure mode.
Step
Method
Condition
1
1026
Steady-state life: 1,000 hours minimum, VCB = -10 V dc, power shall be applied to
achieve TJ = +150°C minimum using a minimum of PD = 75 percent of maximum rated
the test time decreased so long as the devices are stressed for a total of 45,000 device
hours minimum, and the actual time of test is at least 340 hours.
Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a.
For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers
(or from each wafer in the lot) from each wafer lot.
b.
Must be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (group B for JAN, JANTX, and JANTXV) may be pulled prior to
the application of final lead finish.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the test and conditions
specified for subgroup testing in table VII of MIL-PRF-19500, and in 4.4.3.1 (JAN, JANTX, and JANTXV) herein for
group C testing. Electrical measurements (end-points) and delta requirements shall be in accordance with table I,
subgroup 2 and 4.5.4 herein.
6
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