MIL-PRF-19500/627C
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3 or 4 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or
as examples. While every effort has been made to ensure the completeness of this list, document users are
cautioned that they must meet all specified requirements of documents cited in sections 3 or 4 of this specification,
whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at https://quicksearch.dla.mil/).
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows:
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
3.4.1 Lead finish. Unless otherwise specified, lead or end-cap finish shall be solderable in accordance with
MIL-PRF-19500, MIL-STD-750, and herein. When solder alloy is used for finish, the maximum lead temperature is
limited to +175°C maximum. Where a choice of finish is desired, it shall be specified in the acquisition document (see
6.2).
3.4.2 Diode construction. These devices shall be constructed utilizing non-cavity double plug construction with high
temperature metallurgical bonding between both sides of the silicon die and terminal pins (see
MIL-PRF-19500). Metallurgical bond shall be in accordance with the requirements of category I in MIL-PRF-19500.
US version devices shall be structurally identical to the non-surface mount devices except for lead terminations.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business