MIL-PRF-19500-629 Semiconductor Device, Hermetic, Diode, Silicon, Rectifier, Schottky Barrier, Types 1N6702 And 1N6702Us, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for silicon, Schottky barrier rectifier diodes. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance for each unencapsulated die \(element evaluation\).

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MIL-PRF-19500/629C

3.4.2 Diode construction. These devices shall be constructed in a manner and using materials which enable the

diodes to meet the applicable requirements of MIL-PRF-19500 and this document.

3.4.2.1 Surface mount (US). The surface mount (US) version shall be considered structurally identical to the non

surface mount (US) version except for lead attach.

* 3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and table I.

* 3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I and II.

* 3.7 Marking. Devices shall be marked as specified in MIL-PRF-19500.

* 3.7.1 Marking for surface mount US devices. Surface mount (US) suffix parts are to be marked with the polarity

identification. Initial container package marking will be in accordance with MIL-PRF-19500.

* 3.8 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end.

Alternatively, for US suffix devices, a minimum of three contrasting color dots spaced around the periphery on the

cathode end may be used.

* 3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4).

* 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and as specified

herein.

4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-PRF-19500 and herein.

4.2.2 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification

report.

4.2.3 JANHC and JANKC die devices. Qualification for these devices shall be in accordance with

MIL-PRF-19500. This testing may be performed in a TO-5 package in lieu of the axial leaded package.