MIL-PRF-19500/629C
*4.3 Screening (JANTX, JANTXV, and JANS levels only). Screening shall be in accordance with table IV of MIL-
PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I herein.
Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table
Measurement
IV of
MIL-PRF-19500)
JANS level
JANTXV and JANTX level
1a
Required
Not required
1b
Required
Required (JANTXV only)
2
Not required
Not required
3a
Required
Temperature cycling
3b
Not applicable
Not applicable
(1) 3c
Required (see 4.3.3)
Thermal impedance (see 4.3.3)
4, 5, 6 and 7a
Not applicable
Not applicable
7b
Optional
Optional
8
Required
Not required
9
IR1 and VFM2
Not applicable
Required, TA = 90°C; VRWM = 40 V(pk); IO = 0, half
TA = 90°C; VRWM = 40 V(pk); IO = 0, half sine wave, f = 60 Hz
(2) 10
sine wave, f = 60 Hz
Required, ĆIR1 ≤ 100 percent of initial reading or .05
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IR1 and VFM2
mA whichever is greater. ĆVFM2 ≤ ± 50 mV dc.
12
Required, see 4.3.2
See 4.3.2, t = 48 hours
Required, subgroup 2 of table I herein; ĆIR1 ≤ 100
Subgroup 2 of table I herein; ĆIR1 ≤ 100 percent of initial
percent of initial reading or 0.05 mA whichever is
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reading or .05 mA whichever is greater; VFM2 ≤ ± 50 mV dc.
greater; VFM2 ≤ ± 50 mV dc.
14a
Not applicable
Not applicable
14b
Required (3)
Required (3)
15 and 16
Required
Not required
(1) Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in
accordance with appendix E, table IV of MIL-PRF-19500, screen 3 prior to this thermal test.
(2) Junction temperature (TJ) is not to exceed 100°C at VRWM. TJ is affected by the device mounting thermal
resistance when parasitic power is generated by the temperature dependent leakage current. Until this
leakage becomes significant near thermal runaway, TJ remains approximately equal to TA or TL for IO = 0.
(3) For clear glass diodes, gross leak seal test may be performed anytime after temperature cycling.
* 4.3.1 Screening (JANHC or JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a
minimum, die shall be 100 percent probed in accordance with table I, subgroup 2, except for thermal impedance.
* 4.3.1.1 JAN testing. JAN level product will have temperature cycling and thermal impedance testing performed in
accordance with MIL-PRF-19500, JANTX level screening level requirements.
* 4.3.2 Burn-in conditions. Burn-in conditions are as follows: IF = 5 A dc min. TA = room ambient as defined in the
general requirements of 4.5 of MIL-STD-750. Mounting and test conditions in accordance with method 1038 of
MIL-STD-750, test condition B.
* 4.3.3 Thermal impedance (ZθJX measurements). The ZθJX measurements shall be performed in accordance with
method 3101 of MIL-STD-750. The maximum screen limit shall be developed by the supplier using statistical
methods and it shall not to exceed the table I, subgroup 2 herein.
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