MIL-STD-750 Test Methods For Semiconductor DevicesThis standard establishes uniform methods and procedures for testing semiconductor devices suitable for use within Military and Aerospace electronic systems. The methods and procedures in the various parts of this standard cover basic environmental, physical, and electrical tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations. For the purpose of this standard, the term quot;devicesquot; includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This standard is intended to apply only to semiconductor devices. The test methods and procedures described in the various parts of this multipart test method standard have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory that give test results equivalent to the actual service conditions existing in the field and to obtain reproducibility of the results of tests. The test methods described by this standard are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic location since it is known that the only true test for operation in a specific location is an actual service test at that point. b. To describe, in a series of standards, all of the test methods of a similar character which now appear in the various joint-services semiconductor device specifications so that these test methods may be kept uniform and thus result in conservation of equipment, man-hours, and testing facilities. In achieving this objective, it is necessary to make each of the general test methods adaptable to a broad range of devices. c. The test methods described by this standard for environmental, physical, and electrical testing of semiconductor devices shall also apply, when applicable, to parts not covered by an approved military sheet-form standard, specification sheet, or drawing.

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MIL-STD-750F

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c.        Voltages and currents applied in breakdown testing shall be held to a tolerance of ±1 percent of the specified value(s).

d.    Resistive loads shall be ±5 percent tolerance.

e.    Capacitive loads shall be ±10 percent or ±1 picofarad (pF) tolerance, whichever is greater.

f.        Inductive loads shall be ±10 percent or ±5 microhenries (µH) tolerance, whichever is greater. g.        Static parameters shall be measured to a tolerance of ±1 percent.

h.        Switching parameters shall be measured to a tolerance of ±5 percent or ±1 nanosecond (ns), whichever is greater.

4.1.4.1  Control based on uncertainty.  Test processes that have complex characteristics are best performed and controlled by the application of uncertainty analysis.  The overall uncertainty in a test, or measurement process, shall be determined and impact of said uncertainty on the product parameter tolerance shall be taken into account.  The methods used for determining uncertainty shall be defined and documented.  The method selected shall use any, or all, combination of the following forms:

a.        Arithmetic addition (linear):  Normally produces an overly conservative estimate and reflects a highly improbable situation in which contributing errors are at their maximum limit at the same time and same direction.

b.        Root sum square (RSS):  Normally applied where errors tend to fit a normal distribution (Gaussian) and are from independent sources.

c.    Partial derivatives:  Used where complex relationships exist.

d.        Monte Carlo simulation:  Used in very complex situation where other methods are not easily applied or do not fit.

e.    Standard reference material (or controlled correlation device) testing providing observable data.

NOTE:  Observable data from a controlled device may be relied upon to provide feedback that confirms process performance is within statistical limits.

f.     Analysis of systematic and random errors, applying corrections as applicable.

g.    Any other recognized method of combining errors into an expression of uncertainty substantiated by an engineering analysis.

4.1.4.2  Test methods and circuits.  Unless otherwise stated in the specific test method, the methods and circuits shown are given as the basic measurement method.  The methods and circuits shown are not necessarily the only method or circuit which can be used, but the manufacturer shall demonstrate to the acquiring activity that alternate methods or circuits which they may desire to use are equivalent and give results within the desired accuracy of measurement (see 4.1.4).

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