MIL-STD-750 Test Methods For Semiconductor DevicesThis standard establishes uniform methods and procedures for testing semiconductor devices suitable for use within Military and Aerospace electronic systems. The methods and procedures in the various parts of this standard cover basic environmental, physical, and electrical tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations. For the purpose of this standard, the term quot;devicesquot; includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This standard is intended to apply only to semiconductor devices. The test methods and procedures described in the various parts of this multipart test method standard have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory that give test results equivalent to the actual service conditions existing in the field and to obtain reproducibility of the results of tests. The test methods described by this standard are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic location since it is known that the only true test for operation in a specific location is an actual service test at that point. b. To describe, in a series of standards, all of the test methods of a similar character which now appear in the various joint-services semiconductor device specifications so that these test methods may be kept uniform and thus result in conservation of equipment, man-hours, and testing facilities. In achieving this objective, it is necessary to make each of the general test methods adaptable to a broad range of devices. c. The test methods described by this standard for environmental, physical, and electrical testing of semiconductor devices shall also apply, when applicable, to parts not covered by an approved military sheet-form standard, specification sheet, or drawing.

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MIL-STD-750F

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4.1.5 Calibration requirements. Calibration and certification procedures shall be provided in accordance with NCSL Z540.3 for plant standards and instruments used to measure or control production processes and semiconductor devices under test. For those measurements that are not traceable to the National Institute of Standards and Technology (NIST), correlation samples shall be maintained and used as the basis of proving acceptability when such proof is required. In addition, the following requirements shall apply:

a. The accuracy of a calibrating instrument shall be at least four times greater than that of the item being calibrated, unless the item being calibrated is state of the art equipment, which may be near or equal in accuracy to the state of the art calibrating equipment, in which case the four times requirement does not apply. However, the instrument shall be calibrated to correlate with standards established by the NIST.

b. Except in those cases where the NIST recommends a longer period, and concurrence is obtained from the qualifying activity, calibration intervals for plant electrical standards shall not exceed one year and plant mechanical standards shall not exceed two years.

4.2 Orientations.

a. X is the orientation of a device with the main axis of the device normal to the direction of the accelerating force, and the major cross section parallel to the direction of the accelerating force.

b. Y is the orientation of a device with the main axis of the device parallel to the direction of the accelerating force, and the principal base toward (Y1), or away from (Y2), the point of application of the accelerating force.

c. Z is the orientation of a device with the main axis and the major cross section of the device normal to the direction of the accelerating force. Z is 90 degrees of X.

NOTE: For case configurations, other than those shown on figures 1 and 2, the orientation of the device shall be as specified in the individual specification sheet.