MIL-PRF-19500/115N
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
ZZK Zener knee impedance
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500, and figures 1 (DO-13), 2 (DO-41), 3 (DO-213AB), and figures 4 and 5 for (JANHC).
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750 and MIL-PRF-19500 where a
choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.4.2 Diode construction. All devices shall be in accordance with the requirements of MIL-PRF-19500 and as
follows.
3.4.2.1 Dash one construction. Dash one (-1) diodes shall be of metallurgically bonded double plug construction,
(category I, II, and III in accordance with MIL-PRF-19500).
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5.1 Marking of UR version devices. For UR version devices only, all marking (except polarity) may be omitted
from the body, but shall be retained on the initial container.
3.5.2 Polarity. For dash one or UR dash one, the polarity shall be indicated with a contrasting color band to denote
the cathode end or alternately with a minimum of three contrasting color dots spaced evenly around the periphery at
the cathode end.
3.6 Selection of tight tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, or
JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as five
(5) percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tighter
tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish
correlation. For C and D tolerance levels, TL = 30 2C at .375 inches (9.53 mm) from body or equivalent.
3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I.
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and
4.4.3 (see table I, II, and III herein).
3.9 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are
specified in table III herein.
3.10 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and as specified
herein.
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