MIL-PRF-19500/115N
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case
qualification was awarded to a prior revision of the specification sheet that did not request the performance of table II
tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first
inspection lot of this revision to maintain qualification.
4.2.2 JANHC devices. JANHC devices shall be qualified in accordance with MIL-PRF-19500.
4.2.3 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification
report.
4.3 Screening (JAN, JANTXV, and JANTX levels only). Screening shall be in accordance with appendix E, table
E-IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with
table I herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen
(table E-IV of
Measurement
MIL-PRF-19500)
JANTX and JANTXV levels
3a
Temperature cycling
(1) 3c
Thermal impedance (see 4.3.2)
7a
Not applicable
7b
Optional
9
Not applicable
11
IR1 and VZ
12
See 4.3.3
(2) 13
Subgroup 2 of table I herein.
IR1 100 percent of initial reading or 50nA dc, whichever is greater
VZ 2 percent of initial reading.
14a
Applies to DO-13 devices only
(3) 14b
Required
(1) Thermal impedance may be performed any time after sealing provided temperature cycling is performed in
accordance with MIL-PRF-19500, screen 3 prior to this thermal test. (Applicable to -1 and UR-1 devices only).
(2) PDA = 5 percent for screen 13, applies to IR1, VZ. Thermal impedance (ZJX) is not required in screen 13.
(3) For clear glass diodes, the hermetic seal (gross leak) may be performed at anytime after temperature cycling.
4.3.1 Screening (JANHC). Screening of JANHC die shall be in accordance with MIL-PRF-19500.
4.3.1.1 JAN testing. Temperature cycling and thermal impedance testing shall be performed in accordance with
JANTX requirements.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081 as applicable of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (VC
and VH where appropriate). Measurement delay time (tMD) = 70 s max. See table II, group E, subgroup 4 herein.
4.3.3 Power burn-in conditions. Power burn-in conditions are as follows (see 4.5.5): IZ(min) = column 8 of table
III; TA = 75C maximum. Test conditions in accordance with method 1038 of MIL-STD-750, condition B. Adjust IZ or
TA to achieve the required TJ. TJ = 125C minimum. With approval of the qualifying activity and preparing activity,
alternate burn-in criteria (hours, bias conditions, TJ , mounting conditions) may be used for JANTX and JANTXV
quality levels. A justification demonstrating equivalence is required. In addition, the manufacturing site's burn-in data
and performance history will be essential criteria for burn-in modification approval.
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