MIL-PRF-19500/291U
4.3 Screening (JANTX, JANTXV, and JANS levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANS level
JANTXV and JANTX level
1b
Required
Required (JANTXV only)
2
Optional
Optional
3a
Required
Required
3b
Not applicable
Not applicable
(1) 3c
Required method 3131 of MIL-STD-750
Required method 3131 of MIL-STD-750
4
Required
Optional
5
Required
Not required
6
Not applicable
Not applicable
8
Required
Not required
9
Not applicable
ICBO2, hFE4, read and record
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24 hours minimum
24 hours minimum
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ICBO2; hFE4;
ICBO2, hFE4
ĆICBO2 = 100 percent of initial value or
5 nA dc, whichever is greater.
ĆhFE4 = ±15 percent
See 4.3.2
See 4.3.2
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(2) 13
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICBO2 = 100 percent of initial value or 5
ĆICBO2 = 100 percent of initial value or
nA dc, whichever is greater;
5 nA dc, whichever is greater;
ĆhFE4 = ±15 percent
ĆhFE4 = ±15 percent
15
Required
Not required
16
Required
Not required
(1) Shall be performed anytime after temperature cycling, screen 3a; TX and TXV do not need to be repeated in
screening requirements.
(2) PDA = 5 percent for screen 13, applies to ĆICBO2, ĆhFE4, ICBO2, and hFE4. Thermal impedance (ZθJX) is not
required in screen 13.
4.3.1 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500, "Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows
JANS requirements; the JANHC follows JANTX requirements.
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