MIL-PRF-19500-291 Semiconductor Device, Transistor, Pnp, Silicon, Switching, Types 2N2906A, 2N2906Al, 2N2907A, 2N2907Al, 2N2906Aua, 2N2907Aua, 2N2906Aub, 2N2906Aubc, 2N2907Aub, 2N2907Aubc, 2N2906Aubn, 2N2906Aubcn, 2N2907Aubn, And 2N2907Aubcn, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh Janhc, Jankc, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jank...This specification covers the performance requirements for PNP, silicon, switching transistors. Five levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for each unencapsulated device type. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L" "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/291U

Chip size:

.023 x .023 inch �.002 inch (0.584 mm x 0.584 mm �0.0508 mm).

.010 �.0015 inch (0.254 mm �0.038 mm).

Chip thickness:

Top metal:

Aluminum 15,000 � minimum, 18,000 � nominal.

Back metal:

A. Al/Ti/Ni/Ag 15k�/5k�/10k�/10k�.

B. Gold 2.5 k� minimum, 3.0 k� nominal.

C. Eutectic Die Mount - No metal.

SI3N4 2k� minimum, 2.2k nominal.

5. Glassivation:

6. Backside:

Collector.

7. Bonding pad:

B = .0042 x .0042 inch (0.107 mm x 0.107 mm).

E = .0042 x .0042 inch (0.107 mm x 0.107 mm).

FIGURE 4. JANHC and JANKC (B-version) die dimensions.