MIL-PRF-19500/308D
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in section 3 and 4 of this
specification, whether or not they are listed.
2.2 Government documents.
* 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500 -
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at https://quicksearch.dla.mil or https://assist.dla.mil or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
* 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this specification and the references cited herein, the text of this specification takes precedence. Nothing in
this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
* 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
3.4 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be
as specified in MIL-PRF-19500 and figure 1 (DO-5) herein.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500. Where a choice of lead
finish is desired, it shall be specified in the contract or purchase order (see 6.2).
* 3.4.2 Diode construction. These devices shall be constructed in a manner and using materials which enable the
diodes to meet the applicable requirements of MIL-PRF-19500 and this document.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I herein.
* 3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturer's identification and date code
shall be marked on the devices. Initial container package marking shall be in accordance with MIL-PRF-19500.
3.7.1 Polarity. The polarity shall be indicated by a graphic symbol with the arrow pointing toward the negative end
for forward bias. The reversed units shall also be marked with an R following the last digit in the type number.
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