MIL-PRF-19500/348F
Temperature-Power Derating Curve
TC e at ° re Po 3 e6 D L a i N34 ur, L
Temp=r25uC -2Nw4r 7,er, t2ng C68ve
TC=25°C 2N3467, L , 2N33468, L
6
5
4
3
2
1
0
25
50
75
100
125
150
175
200
225
Top (ºC) (Case)
DC Operation
Thermal Resistance Junction to Case = 30.0ºC/W
NOTES:
1. Top curve is thermal runaway loci and cannot be used as a derate design curve since it exceeds the maximum
ratings for this part. Operating under this curve using these mounting conditions assures the device will not
have a thermal runaway. This is the true inverse of the worst case thermal resistance value extrapolated out to
the thermal runaway point.
2. Derate design curve constrained by the maximum junction temperature (TJ ≤ 200°C) and power rating specified.
(See 1.3 herein.)
3. Derate design curve chosen at TJ ≤ 150°C, where the maximum temperature of electrical test is performed.
4. Derate design curves chosen at TJ ≤ 125°C, and 110°C to show power rating where most users want to limit TJ
in their application.
* FIGURE 3. Temperature-power derating R
.
ΘJC
14
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