MIL-PRF-19500/348F
* 4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a lot failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during conformance inspection shall be analyzed to the extent possible to identify root cause and corrective
action. Whenever a failure is identified as wafer lot and wafer processing related, the entire wafer lot and related
devices assembled from the wafer lot shall be rejected unless an appropriate determined corrective action to
eliminate the failure mode has been implemented and the devices from the wafer lot are screened to eliminate the
failure mode.
Step
Method
Condition
1
1026
Steady-state life: 1,000 hours minimum, VCB = 10 dc, power shall be applied to achieve
TJ = +150°C minimum using a minimum of PD = 75 percent of maximum rated PT as
defined in 1.3. n = 45, c = 0.
Blocking life: 48 hours minimum, TA = +150°C, VCB = 80 percent of rated voltage.
2
1048
n = 45, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
* 4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN, JANTX, and JANTXV, samples shall be selected randomly from a minimum of three wafers (or from
each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection lot. See
MIL-PRF-19500.
b. Must be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2, conformance
inspection. When the final lead finish is solder or any plating prone to oxidation at high temperature, the
samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANTX, and JANTXV) may be
pulled prior to the application of final lead finish.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VII of MIL-PRF-19500, and in 4.4.3.1 (JANS) and 4.4.3.2 (JAN, JANTX, and JANTXV)
herein for group C testing. Electrical measurements (end-points) and delta requirements shall be in accordance with
table I, subgroup 2 and 4.5.3 herein.
* 4.4.3.1 Group C inspection, table VII (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
C2
2036
Test condition E.
t = 1,000 hours, VCB = 10 V dc, power temperature shall be applied to the device to
C6
1026
achieve TJ = +150°C minimum, and minimum power dissipation of 75 percent of
maximum rated PT (see 1.3 herein); n = 45, c = 0.
For solder die attach, VCB ≥ 10 V dc, 6,000 cycles.
1037
* 4.4.3.2 Group C inspection, table VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method Condition
C2
2036
Test condition E.
RΘJA, RΘJC only (see 1.3).
C5
3131
C6
Not applicable.
7
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