MIL-PRF-19500/348F
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 , c = 0
inspection 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 , c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles. n = 22 , c = 0
Hermetic seal 4/
1071
n = 22 , c = 0
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2
Precondition TA = +250°C at t = 24 hours
Bond strength 3/ 4/
2037
or TA = +300°C at t = 2 hours
n = 11 wires, c = 0
2075
n=4,c=0
Decap internal visual
(design verification) 4/
Subgroup 2
°C/W
ZΘJX
Thermal impedance
3131
See 4.3.2.
Breakdown voltage
3001
Bias condition D;
V(BR)CBO
IC = 10 µA dc
collector to base
2N3467, L
40
V dc
2N3468, L
50
V dc
3026
Bias condition D;
V(BR)EBO
5.0
V dc
Breakdown voltage
IE = 10 µA dc
emitter to base
Breakdown voltage,
3011
Bias condition D;
V(BR)CEO
collector to emitter
IC = 10 mA dc; pulsed (see 4.5.1)
2N3647, L
40
V dc
2N3648, L
50
V dc
ICBO1
100
nA dc
3036
Bias condition D;
Collector to base
VCB = 30 V dc
cutoff current
3041
Bias condition A; VEB = 3.0 V dc;
Collector to emitter
ICEX
100
nA dc
cutoff current
VCE = 30 V dc
Forward to current
3076
VCE = 1.0 V dc;
hFE1
transfer ratio
IC = 150 mA dc; pulsed (see 4.5.1)
2N3467, L
40
2N3468, L
25
See footnotes at end of table.
9
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