MIL-PRF-19500/349J
TABLE I. Group A inspection.
Inspection 1/ 2/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 3/
Visual and mechanical 4/
2071
JAN, JANTX: n = 45 devices, c = 0
examination
JANTXV: n = devices, c = 0
n = 15 leads, c = 0
Solderability 4/ 5/
2026
n = 15 devices, c = 0
1022
Resistance to solvents
4/ 5/ 6/
Temp cycling 4/ 5/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 5/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Table I, subgroup 2
Electrical measurements 5/
Precondition TA = +250°C at
Bond strength 4/ 5/
2037
t = 24 hrs or
TA = 300°C at t = 2 hrs
n = 11 wires, c = 0
Decap internal visual
2075
n = 4 devices, c = 0
(design verification) 4/
Subgroup 2
°C/W
Thermal impedance 7/
3131
See 4.3.2
ZθJX
Bias condition D, IC = 100 µA dc
Breakdown voltage collector
3001
V(BR)CBO
to base
2N3506
60
V dc
2N3507
80
V dc
Bias condition D, IE = 10 µA dc
Breakdown voltage emitter
3026
5
V dc
V(BR)EBO
to base
Breakdown voltage collector
3011
Bias condition D, IC = 10 mA dc,
V(BR)CEO
to emitter
pulsed (see 4.5.1)
2N3506
40
V dc
2N3507
50
V dc
µA dc
Collector to emitter cutoff
3041
1
Bias condition A, VEB = 4 V dc
ICEX1
current
2N3506
VCE = 40 V dc
2N3507
VCE = 60 V dc
Forward-current transfer
3076
VCE = 1 V dc, IC = 500 mA dc,
hFE1
ratio
pulsed (see 4.5.1)
2N3506
50
250
2N3507
35
175
See footnotes at the end of table
11
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