MIL-PRF-19500-349 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N3506, 2N3506A, 2N3506L, 2N3506Al, 2N3506U4, 2N3506Au4, 2N3507, 2N3507L, 2N3507A, 2N3507Al, 2N3507U4, And 2N3507Au4, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Jankca, Jankcam, Jankcad, Jankcap, Jankcal, Jankcar, Jankcaf, Jankcag, And JankcahThis specification covers the performance requirements for NPN, silicon, switching transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/349J

4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following

requirements:

Samples shall be selected from each wafer from a die fabrication line that the manufacturer chooses to

certify for the die design used in products manufactured to this specification.

Shall be chosen from an inspection lot that has been submitted to and passed group A conformance

inspection. When the final lead finish is solder or any plating prone to oxidation at high temperature, the

samples for life test (subgroups B3 and B5 for JANS, and group B for JAN, JANTX, and JANTXV) may be

pulled prior to the application of final lead finish.

4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table E-VII of MIL-PRF-19500, and in 4.4.3.1 (JANS) and 4.4.3.2 (JAN, JANTX, and JANTXV)

herein for group C testing. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2

herein.

4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.

Subgroup

Method

Condition

2036

Test condition E, not applicable for U4 devices.

3131

RθJA and RθJC only, as applicable (see 1.3 and 4.3.2).

1026

Steady-state life: 1,000 hours, VCB = 10 V dc, power shall be applied to achieve

TJ = +150�C minimum using a minimum of PD = 75 percent of maximum rated PT as

defined in 1.3. n = 45 devices, c = 0. The sample size may be increased and the test time

decreased as long as the devices are stressed for a total of 45,000 device hours minimum,

and the actual time of test is at least 340 hours.

4.4.3.2 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.

Subgroup

Method

Condition

2036

Test condition E, not applicable for U4 devices.

3131

RθJA and RθJC (see 1.3 and 4.3.2).

Not applicable.

4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any

inspection lot containing the intended package type and lead finish procured to the same specification which is

submitted to and passes group A tests for conformance inspection. Testing of a subgroup using a single device type

enclosed in the intended package type shall be considered as complying with the requirements for that subgroup.

4.4.4 Group D inspection. Conformance inspection for hardness assured JANS and JANKC types shall include

the group D tests specified in table II herein. These tests shall be performed as required in accordance with

MIL-PRF-19500 and method 1019 of MIL-STD-750, for total ionizing dose or method 1017 of MIL-STD-750 for

neutron fluence as applicable (see 6.2.e herein), except group D, subgroup 2 may be performed separate from other

subgroups. Group D inspection may also be performed ahead of the screening lot using die selected in accordance

with MIL-PRF-19500 and related documents. Alternate package options may also be substituted for the testing

provided there is no adverse effect to the fluence profile.