MIL-PRF-19500/368M
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened
devices shall be submitted to and pass the requirements of group A1 and A2 inspection only (table E-VIb, group B,
subgroup 1 is not required to be performed again if group B has already been satisfied in accordance with 4.4.2).
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in E-VIa (JANS) of 4.4.2.1 herein. Electrical measurements (end-points) requirements shall be in
accordance with table I, subgroup 2 herein. See 4.4.2.2 for JAN, JANTX, and JANTXV group B testing. Electrical
measurements (end-points) requirements shall be in accordance with table I, subgroup 2 herein.
4.4.2.1 Group B inspection, table E-VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
B4
1037
VCB = 10 V dc, 2,000 cycles.
VCB = 10 V dc; PD ≥ 100 percent of maximum rated PT (see 1.3).
B5
1027
(NOTE: If a failure occurs, resubmission shall be at the test conditions of the
original sample.)
Option 1: 96 hrs minimum, sample size in accordance with table VIa of
MIL-PRF-19500, adjust TA or PD to achieve TJ = +275°C minimum.
Option 2: 216 hrs minimum, sample size = 45, c = 0; adjust TA or PD to achieve
TJ = +225°C minimum.
RθJA for TO-5 and TO-39, RθJC for U4 only (see 1.3 and 4.3.3).
B6
3131
4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a group B failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during CI shall be analyzed to the extent possible to identify root cause and corrective action. Whenever a
failure is identified as wafer lot or wafer processing related, the entire wafer lot and related devices assembled from
the wafer lot shall be rejected unless an appropriate determined corrective action to eliminate the failure mode has
been implemented and the devices from the wafer lot are screened to eliminate the failure mode.
Step
Method
Condition
Steady-state life: 1,000 hours, VCB = 10 dc, power shall be applied to achieve TJ = +150°C
1
1026
minimum using a minimum of PD = 75 percent of maximum rated PT as defined in 1.3. n = 45
devices, c = 0. The sample size may be increased and the test time decreased as long as the
devices are stressed for a total of 45,000 device hours minimum, and the actual time of test is
at least 340 hours.
Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
10
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business