MIL-PRF-19500/368M
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Conditions
Min
Max
Subgroup 1 2/
2071
n = 45 devices, c = 0
Visual and mechanical 3/
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to 3/ 4/ 5/
1022
n = 15 devices, c = 0
solvent
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2
Precondition TA = +250°C at t = 24 hrs
Bond strength 3/ 4/
2037
or TA = +300°C at t = 2 hrs,
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification) 4/
Subgroup 2
°C/W
Thermal impedance 6/
3131
See 4.3.3
ZθJX
µA dc
Emitter to base cutoff current
3061
10
Bias condition D, VEB = 7 V dc
IEBO1
Collector to emitter cutoff
3041
Bias condition D
ICEO
µA dc
2N3439, 2N3439L,
2
VCE = 300 V dc
2N3439UA, 2N3439U4
µA dc
2N3440, 2N3440L,
2
VCE = 200 V dc
2N3440UA, 2N3440U4
Collector to emitter cutoff
3041
Bias condition A, VBE = -1.5 V dc
ICEX
current
µA dc
2N3439, 2N3439L,
5
VCE = 450 V dc
2N3439UA, 2N3439U4
µA dc
2N3440, 2N3440L,
5
VCE = 300 V dc
2N3440UA, 2N3440U4
See footnotes at end of table.
13
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