MIL-PRF-19500/396L
4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or from
each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection lot.
See MIL-PRF-19500.
b. Must be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANTX, and
JANTXV) may be pulled prior to the application of final lead finish.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and in 4.4.3.1 (JANS) and 4.4.3.2 (JAN, JANTX, and JANTXV)
herein for group C testing. Electrical measurements (end-points) and delta requirements shall be in accordance with
table I, subgroup 2 and 4.5.2 herein.
4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
C2
2036
Test condition E. (Does not apply to U4 and UA)
1,000 hours at VCB = 10 V dc; TJ = +150°C min. External heating of the device
C6
1027
under test to achieve TJ = +150°C minimum is allowed provided that a minimum of
75 percent of rated power is dissipated. No heat sink or forced-air cooling on
device shall be permitted.
4.4.3.2 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
C2
2036
Test condition E. (Does not apply to U4 and UA)
C5
3131
Thermal resistance see figures 13 through 19 (only applies to RθJA for TO-39, TO-5
TO-46, and RθJC for U4). See 4.3.3.
C6
Not applicable.
* 4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any
plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of
final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be
considered as complying with the requirements for that subgroup.
* 4.4.4 Group D inspection. Conformance inspection for hardness assured JANS and JANTXV types shall include
the group D tests specified in table II herein. These tests shall be performed as required in accordance with
MIL-PRF-19500 and method 1019 of MIL-STD-750, for total ionizing dose or method 1017 of MIL-STD-750 for
neutron fluence as applicable (see 6.2 herein), except group D, subgroup 2 may be performed separate from other
subgroups. Group D inspection may also be performed ahead of the screening lot using die selected in accordance
with MIL-PRF-19500 and related documents. Alternate package options may also be substituted for the testing
provided there is no adverse effect to the fluence profile.
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