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MIL-PRF-19500-396 Semiconductor Device, Transistor, Pnp, Silicon, Switching, Types 2N3762, 2N3762L, 2N3762U4, 2N3762Ua, 2N3763, 2N3763L, 2N3763U4, 2N3763Ua, 2N3764, And 2N3765, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh Janhca, Jankca, Jankcam, Jankcad, Jankcap, Jankcal, Jankcar, Jankcaf, Jankcag, And JankcahThis specification covers the performance requirements for PNP silicon switching transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for each unencapsulated device type. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/396L
NOTES:
1. Chip size ...............
.040 inch (1.02 mm) x .040 inch (1.02 mm) ±.001 inch (0.03 mm).
2. Chip thickness ......
.010 ±.0015 inch.
3. Top metal ..............
Aluminum 15,000Å minimum, 18,000Å nominal.
4. Back metal ............
Gold 3,500Å minimum, 5,000Å nominal.
5. Backside ...............
Collector.
6. Bonding pad..........
B = .006 inch (0.15 mm) x .008 inch (0.2 mm),
E = .006 inch (0.15 mm) x .004 inch (0.1 mm).
FIGURE 5. JANHCA and JANKCA die dimensions.
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