MIL-PRF-19500/397J
*
4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.
Method
Condition
Subgroup
C2
2036
Test condition E; (not applicable for U4 devices).
*
C5
3131
RθJA for TO-39, UA, and UB. RθJC for U4.
VCB = 10 to 30 V dc; TJ = +175°C minimum. No heat sink or forced-air cooling
C6
1026
on the devices shall be permitted.
*
4.4.3.2 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Method
Condition
Subgroup
C2
2036
Test condition E; (Not applicable for U4 devices).
See 4.4.5, RθJA for TO-39. RθJC for U4.
C5
3131
C6
Not applicable.
4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any lot
containing the intended package type and lead finish procured to the same specification which is submitted to and
passes table I tests for conformance inspection. Testing of a subgroup using a single device type enclosed in the
intended package type shall be considered as complying with the requirements for that subgroup.
* 4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements (end-points) shall
be in accordance with table I, subgroup 2 herein.
4.4.5 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with method
3131 of MIL-STD-750.
a. IM measurement............................................................................ 10 mA.
b. VCE measurement voltage (same as VH) .................................... 25 V dc.
c. IH collector heating current ........................................................... 0.2 A dc.
d. VH collector-emitter heating voltage ............................................. 25 V dc.
e. tH heating time ............................................................................ 1 second minimum.
f. tMD measurement delay time ........................................................ 50 µs maximum.
g. tSW sampling window time ........................................................... 10 µs maximum.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
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