MIL-PRF-19500/397J
* 4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table-E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
(1) 3c
Thermal impedance, method 3131
Thermal impedance, method 3131
of MIL-STD-750
of MIL-STD-750
9
Not applicable
ICBO1
11
ICBO1 and hFE4
ICBO1 and hFE4
ĆICBO = 100 percent of initial value
or 50 nA dc, whichever is greater
12
See 4.3.1
See 4.3.1
240 hours minimum
13
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICBO1 = 100 percent of initial value
ĆICBO1 = 100 percent of initial
or 50 nA dc, whichever is greater;
value or 50 nA dc, whichever is
greater; ĆhFE4 = ±20 percent
ĆhFE4 = ±15 percent
14
Required
Required
*
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc, TA = 25°C + 5°C.
Power shall be applied to the device to achieve the required junction temperature, TJ = +135°C minimum using a
minimum power dissipation = 75 percent of max PT as defined in 1.3. NOTE: No heat sink or forced air cooling on
the devices shall be permitted. Power burn-in conditions for "U4" suffix devices are identical to their corresponding
non suffix devices.
4.3.2 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500, "Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows
JANS requirements; the JANHC follows JANTX requirements.
* 4.3.3 Thermal impedance (ZθJX measurements). The ZθJX measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD (and VC where
appropriate). The ZθJX limit used in screen 3c of 4.3 and subgroup 2 of table I shall comply with the thermal
impedance graph on figures 9 through 11 (less than or equal to the curve value at the same tH time) or shall be less
than the process determined statistical maximum limit as outlined in method 3131.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with the applicable inspections of table I,
subgroup 2 herein.
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