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MIL-PRF-19500-397 Semiconductor Device, Transistor, Pnp, Silicon, Types 2N3743, 2N3743U4, 2N4930, 2N4930U4, 2N4931, And 2N4931U4, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for PNP, silicon, high-voltage transistor. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance for die are provided for each unencapsulated device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/397J
Letter
Dimensions
Inches
Millimeters
Min
Max
Min
Max
A
.041
.041
1.04
1.04
C
.041
.041
1.04
1.04
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. The physical characteristics of the die are:
Thickness:
.006 inch (0.15 mm) to .012 inch (0.30 mm).
Top metal:
Aluminum 17,500 Å minimum, 20,000 Å nominal.
Back metal:
Gold 2,500 Å minimum, 3,000 Å nominal.
Back side:
Collector.
Bonding pad:
B = .004 inch (0.10 mm) x .005 inch (0.13 mm).
E = .004 inch (0.10 mm) x .0055 inch (0.14 mm).
4. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 3. JANHC and JANKC (A-version) die dimensions.
5



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