MIL-PRF-19500-397 Semiconductor Device, Transistor, Pnp, Silicon, Types 2N3743, 2N3743U4, 2N4930, 2N4930U4, 2N4931, And 2N4931U4, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for PNP, silicon, high-voltage transistor. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance for die are provided for each unencapsulated device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/397J

NOTES:

1. Chip size:

40 x 40 mils �1 mil.

2. Chip thickness:

10 �1.5 mil.

3. Top metal:

Aluminum 15,000� minimum, 18,000� nominal.

4. Back metal:

A. Al/Ti/Ni/Ag 12k�/3k�/7k�/7k� min., 15k�/5k�/10k�/10k� nom.

B. Gold 2,500� minimum, 3,000� nominal.

C. Eutectic Mount � No Gold.

5. Backside:

Collector.

6. Bonding pad:

B = 6 x 8 mils, E = 6 x 4 mils.

FIGURE 4. JANHC and JANKC (B-version) die dimensions.