MIL-PRF-19500/402F
* 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Measurement
Screen (see table E-IV
of MIL-PRF-19500
JANTX and JANTXV levels only
(1) 3c
Thermal impedance (see 4.3.2)
9
Not applicable
hFE2 and ICBO1
11
12
See 4.3.1
Subgroup 2 of table I herein, ICBO1 = 100 percent of
13
initial value or 1 A dc, whichever is greater hFE2 =
±20 percent of initial value
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to
be repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: 2N3739 - VCB = 10 - 30 V dc,
TJ = +162.5C ±12.5C
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 s max. See table II, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. Group A inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIB (JAN, JANTX, and JANTXV), of MIL-PRF-19500 and as follows. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
Subgroup
Method
Conditions
For solder die attach: VCB 10 V dc, 2,000 cycles. TA +35C.
B3
1037
For eutectic die attach: VCB = 10 V dc, TA +35C adjust PT to achieve TJ = +150C
1026
min.
5
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