MIL-PRF-19500/448F
TABLE I. Group A inspection.
MIL-STD-750
Limits
Symbol
Unit
Inspection 1/
Method
Conditions
Min
Max
Subgroup 1 2/
2071
Visual and mechanical
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours,
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification) 4/
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2.
ZθJX
Breakdown voltage,
3011
80
V dc
Bias condition D, IC = 10 mA dc
V(BR)CEO
collector to emitter
pulsed (see 4.5.1)
µA dc
Collector to base cutoff
3036
10
Bias condition D, VCB = 80 V dc
ICBO1
current
Collector to base cutoff current
3036
25
nA dc
Bias condition D, VCB = 60 V dc
ICBO2
µA dc
Emitter to base breakdown
3061
10
Bias condition D, VEB = 5.0 V dc
IEBO1
voltage
Emitter to base cutoff current
3061
25
nA dc
Bias condition D, VEB = 3.0 V dc
IEBO2
Forward-current transfer ratio
3076
75
VCE = 5 V dc; IC = 0.1 mA dc;
hFE1
pulsed (see 4.5.1)
Forward-current transfer ratio
3076
100
VCE = 5 V dc; IC = 10 mA dc;
hFE2
pulsed (see 4.5.1)
See footnotes at end of table.
9
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