MIL-PRF-19500/488E
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
Subgroup Method
Conditions
C2
1056
Test condition B.
C2
2036
Test condition A, weight = 10 lbs, application time = 15 seconds.
*
C5
3131
See 4.5.2, RθJC = 1.25°C/W.
For eutectic die attach: TA +35C; adjust PT to achieve TJ = +187.5C 5C, VCB 30 V dc
C6
1026
For solder die attach: VCB 30 V dc, 6,000 cycles.
C6
1037
* 4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
* 4.5.2 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 3131
of MIL-STD-750 using the guidelines in that method for determining IM, IH, and tH. Measurement delay time tMD = 300
ms max. See table E-IX of MIL-PRF-19500. Forced moving air or draft shall not be permitted across the devices
during test.
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