MIL-PRF-19500/542J
4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a
minimum, die shall be 100 percent probed in accordance with table I, subgroup 2 except test current shall not exceed
20 amperes.
4.3.2 Gate stress test. Apply VGS = 30 V minimum for t = 250 µs minimum.
4.3.3 Single pulse unclamped inductive switching.
a. Peak current, ID ................................Rated ID1.
b. Peak gate voltage, VGS .....................10 V.
c. Gate to source resistor, RGS..............25 ≤ RGS ≤ 200.
d. Initial case temperature ....................+25°C +10, -5°C.
e. Inductance ........................................100 µH minimum.
f. Number of pulses to be applied .........1 pulse minimum.
g. Supply voltage VDD ...........................50 V.
4.3.4 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
(See figure 5 herein.) Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein. Alternate flow is allowed for conformance inspection in accordance with appendix E of
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table E-V of
MIL-PRF-19500 and table I herein. Electrical measurements (end-points) shall be in accordance with the inspections
of table I, subgroup 2 herein.
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