MIL-PRF-19500/547D
* 4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein.
* 4.3.2 Gate stress test. Apply VGS = 30 V minimum for t = 250 µs minimum.
* 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein. Electrical measurements (end-points) shall be in accordance with the inspections of table I, subgroup 2
herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS) and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500, and herein.
End-point electrical measurements shall be in accordance with table I, subgroup 2 herein.
4.4.2.1 Group B inspection table E-VIA (JANS) of MIL-PRF-19500.
Subgroup
Method
Conditions
B3
1051
Test condition G.
B4
1042
Test condition D; 2,000 cycles. The heating cycle shall be 1 minute minimum.
Accelerated steady-state operation life; test condition C; TA = + 25°C, - 5°C, + 10°C,
B5
1042
VDS = 10 V min.; ID adjusted to meet a junction temperature of 140°C, - 0°C, + 10°C,
t = 240 hours.
B5
2037
Bond strength (Al-Au die interconnects only); test condition D.
* 4.4.2.2 Group B inspection, table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
B2
1051
Test condition G, 25 cycles.
*
B3
1042
Intermittent operation life, condition D, 2,000 cycles . No heat sink or forced air
cooling on the device shall be permitted during the on cycle;
ton = 30 seconds minimum.
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