MILPRF19500/581C
4.3 Screening (quality levels JANTX and JANTXV only). Screening shall be in accordance with table EIV of
MILPRF19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table EIV
Measurement
of MILPRF19500)
JANTX and JANTXV level
3c (1)
Thermal impedance (see 4.3.1)
ICBO and hFE2
11
12
See 4.3.2.
13
See table I, subgroup 2 herein
ĆICBO = 100 percent of initial value, or 10 nA dc
whichever is greater;
ĆhFE2 = ±15 percent of initial value.
(1) Thermal impedance shall be performed anytime before screen 10 and does not
need to be repeated in the screening requirements.
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with test
method 3131 of MILSTD750 using the guidelines in that test method for determining IH, IM, tH, tSW, (and VC where
appropriate). The thermal impedance limit used in 4.3, screen 3c and table I, subgroup 2 shall comply with the
thermal impedance graph on figures 4 and 5 (less than or equal to the curve value at the same tH time) and shall be
less than the process determined statistical maximum limit as outlined in test method 3131 of MILSTD750.
4.3.2 Power burn-in conditions. Power burn-in conditions shall be as follows: VCB = 10 to 30 V dc. Power shall be
applied to achieve TJ = +135°C minimum using a minimum PD = 75 percent of PT maximum, TA ambient rated as
defined in 1.3. With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias
conditions, TJ, and mounting conditions) may be used. A justification demonstrating equivalence is required. In
addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in
modification approval.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MILPRF19500, and as
specified herein. If alternate screening is being performed in accordance with MILPRF19500, a sample of
screened devices shall be submitted to and pass the requirements of table I, subgroups 1 and 2 herein. Table
EVIB, subgroup 1, of MILPRF19500 is not required to be performed again since solderability and resistance to
solvents testing is performed in table I, subgroup 1 herein.
4.4.1 Group A inspection (small die flow). Group A inspection shall be conducted in accordance with table EV of
MILPRF19500 and table I herein. The small die flow part of table EV, subgroup 1 shall apply. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
4.4.2 Group B inspection (small die flow). Group B inspection shall be conducted in accordance with the test
methods and conditions specified for the applicable steps in table EVIC of MILPRF19500 and herein. Electrical
measurements (end-points) and delta requirements shall be taken after each step in 4.4.2.1. Electrical measurements
(end-points) shall be in accordance with table I, subgroup 2 herein. Delta requirements shall be in accordance with
the applicable step of 4.6 herein.
5
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