MILPRF19500/581C
4.4.2.1 Group B small die flow inspection details (for quality levels JAN, JANTX, and JANTXV). Separate samples
may be used for each step. In the event of a lot failure, the resubmission requirements of MILPRF19500 shall
apply. In addition, all catastrophic failures during CI shall be analyzed to the extent possible to identify root cause
and corrective action. Whenever a failure is identified as wafer lot, or wafer processing related, the entire wafer lot,
and related devices assembled from the wafer lot, shall be rejected unless an appropriate determined corrective
action to eliminate the failure mode has been implemented and the devices from the wafer lot are screened to
eliminate the failure mode.
Step
Method
Conditions
Steady-state operation life: 1,000 hours minimum, VCB = 10 V dc, power shall be
1
1026
applied to achieve TJ = +150°C minimum using a minimum of PD = 75 percent of
be increased and the test time decreased as long as the devices are stressed for a
total of 45,000 device hours minimum, and the actual time of test is at least 340
hours.
Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
4.4.2.2 Group B small die flow sample selection (for quality levels JAN, JANTX, and JANTXV). Samples selected
for group B inspection shall meet the following requirements:
a.
Samples shall be selected randomly from a minimum of three wafers (or from each wafer in the lot) from
each wafer lot. See MILPRF19500.
b.
Samples shall be chosen from an inspection lot that has passed table I, subgroup 2, conformance
inspection. When the final lead finish is solder, or any plating prone to oxidation at high temperature, the
samples for life test may be selected prior to the application of final lead finish.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table EVII of MILPRF19500 and as follows herein. Electrical measurements
(end-points) shall be in accordance with table I, subgroup 2 herein.
Subgroup
Method
Conditions
C2
2036
Test condition E.
See 1.3.
C5
3131
4.4.3.1 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any
plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of
final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be
considered as complying with the requirements for that subgroup.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table EIX of MILPRF19500 and as specified in table II herein. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein. Delta requirements shall be in
accordance with the applicable step of 4.6 herein.
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