MIL-PRF-19500/585K
1.3.2 Maximum ratings Continued.
(1)
Average current with a half-sine wave including reverse voltage amplitude equal to the magnitude of the full
rated VRWM.
Derate linearly 1.05 percent/C for TL > +55C.
(2)
(3)
These rated currents also apply to U or US suffix types when the maximum temperature of the end-caps
(mounting surface) is +110C; derate linearly 2.5 percent/C above TEC > +110C.
Derate linearly 0.80 percent/C for TA > +25C.
(4)
The 1 A rating at +25C ambient is for thermal mounting methods (PC boards or other) where thermal
(5)
resistance from mounting point to ambient is still sufficiently controlled where TJ(MAX) in 1.3.1 is not
exceeded. This equates to RθJX ≤ 55ēC/W as shown. Also see application notes in 6.5.1 for the worst-case
for 1N6625.
The reverse recovery time (method 4031 of MIL-STD-750, condition B) at TJ = +125C will not exceed three
(6)
times the +25C limit. Exceeding TJ = +125C may change reverse recovery times at +25C to higher levels
as indicated in accelerated life testing in 4.4.2.1, subgroup B5 for JANS, or other life testing in 4.4.2.2,
subgroup B3, and 4.4.3.1, subgroup C6.
(7)
See figure 3, thermal resistance curves for axial leaded devices only (no suffix).
See figure 4, thermal resistance curves for surface mount devices only (U and US suffix).
(8)
1.4 Primary electrical characteristics. Unless otherwise specified, TA = +25C.
Col. 1
Col. 2
Col. 3
Col. 4
Col. 5
Col. 6
Col. 7
Device type
VFM1
IRM(REC)
IR2
CT at
IR1
VFM2
at
at
at 2 A,
VR = 10 V
at TJ =
at TJ =
100 A/s
+150C
+25C
IF = Col. 3
IF = Col. 4
A
A
A pk
pF
V
V
1N6620, U, US
0.5
150
3.5
10
1.60
1.40
1N6621, U, US
0.5
150
3.5
10
1.60
1.40
1N6622, U, US
0.5
150
3.5
10
1.60
1.40
1N6623, U, US
0.5
150
4.2
10
1.80
1.55
1N6624, U, US
0.5
150
4.2
10
1.80
1.55
1N6625, U, US
1.0
200
5.0
10
1.95
1.75
2
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