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MIL-PRF-19500-606 Semiconductor Device, Field Effect Radiation Hardened \(Total Dose Only\) Transistors, N-Channel, Silicon, Types 2N7291, 2N7293, 2N7295, And 2N7297, Jantxvm, D, And R, And Jansm, D, And RThis specification covers the performance requirements for an N-Channel, enhancement-mode, MOSFET, radiation hardened \(total dose only\), power transistor. Two levels of product assurance are provided for each device type specified in MIL-PRF-19500.

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MIL-PRF-19500/606B
* 4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Method
Conditions
Subgroup
*
B3
2077
SEM
VDS = rated; TA = +175°C; t = 240 hours min. Read and record VBR(DSS) (pre and
*
B5
1042
post) at ID = 1 mA. Read and record IDSS (pre and post) in accordance with table
IV.
Condition B, VGS = rated; TA = +175°C, t = 24 hours.
B5
1042
B5
2037
Test condition A, all internal wires for each device shall be pulled separately.
B5
3161
See 4.5.2.
* 4.4.2.2 Group B inspection, table VIb (JANTXV) of MIL-PRF-19500.
Method
Conditions
Subgroup
B2
1051
Test condition G, 25 cycles.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table VII of MIL-PRF-19500, and herein. Electrical measurements (end-points) and
delta requirements shall be in accordance with the applicable steps of table IV herein.
Method
Conditions
Subgroup
C2
1056
Condition B.
C2
2036
Test condition A, weight = 10 pounds; t = 15 s.
*
C5
3161
See 4.5.2.
C6
1042
Test condition D, 6,000 cycles; a cycle shall be 30 seconds minimum.
4.4.4 Group D Inspection. Group D inspection shall be conducted in accordance with appendix E, table VIII of
MIL-PRF-19500 and table II herein.
* 4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table IX of MIL-PRF-19500 and as specified in table III herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
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