MIL-PRF-19500/616G
3.4.1 Lead formation and finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and
herein. Where a choice of lead finish or formation is desired, it shall be specified in the acquisition document (see
6.2). When lead formation is performed, as a minimum, the vendor shall perform 100 percent hermetic seal in
accordance with screen 14 of MIL-PRF-19500.
3.4.2 Polarity. Polarity and terminal configuration shall be in accordance with figure 1 herein.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3 and table I herein.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
b.
Screening (see 4.3).
c.
Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case
qualification was awarded to a prior revision of the specification sheet that did not request the performance of table II
tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first
inspection lot of this revision to maintain qualification.
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