MIL-PRF-19500/118L
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500
and on figures 1, 2, and 3 herein.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.4.2 Diode construction. All devices shall be metallurgically bonded, double plug construction in accordance with
the requirements of MIL-PRF-19500. All glass diodes shall be designed with sufficient thermal compensation in the
axial direction to optimize tensile and compressive stresses. Dimensional analysis is required of all materials used to
achieve axial thermal compensation. Dimensional tolerances and corresponding coefficient of thermal expansion
(CTE) shall be documented on the DSCC Design and construction Form 36D and shall be approved by the qualifying
activity to maintain qualification. Dimensional tolerances shall be sufficiently tight enough to prevent excessive
stresses due to the inherent CTE mismatch. The UR versions shall be structurally identical to the axial leaded
versions except for end-cap lead attachment. The `US' version shall be metallurgically bonded, thermally matched,
non-cavity, double-plug construction in accordance with the requirements of category I (see MIL-PRF-19500).
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturer's identification and date code
shall be marked on the devices. Initial container package marking shall be in accordance with MIL-PRF-19500. The
polarity shall be indicated with a contrasting color band to denote the cathode end. The prefixes JAN, JANTX, and
JANTXV can be abbreviated as J, JX, and JV, respectively. The part number may be reduced to J5194, JX5194, or
JV5194. No color coding shall be permitted for part numbering.
3.5.1 Marking of UR and US devices. UR and US devices shall be marked with a cathode band as a minimum; or
a minimum of three evenly spaced contrasting color dots around the periphery of the cathode end may be used. At
the option of the manufacturer, devices may include laser marking on an end-cap, to include part number and lot date
code for all levels. The prefixes JAN, JANTX, or JANTXV may be abbreviated as J, JX, or JV, respectively. (For
example: The part number may be reduced to JV5194). All device marking, except for polarity and serial numbers,
shall also appear on the unit package used as the initial protection for delivery.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I.
3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
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