MILPRF19500/124L
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
Test Methods for Semiconductor Devices.
FEDERAL STANDARDS
FEDSTDH28
ScrewThread Standards for Federal Services.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch or
https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 191115094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MILPRF19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML)
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MILPRF19500, and herein on figure 1 (DO4).
3.4.1 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MILPRF19500,
MILSTD750, and herein. Where a choice of lead finish is desired, it shall be specified in the contract (see 6.2).
3.4.2 Polarity. The polarity of device types shall be as follows:
a.
Device types 1N2970B through 1N3015B and 1N3993RA through 1N3998RA shall have the anode
connected to the stud (term 2 of figure 1).
b.
Device types 1N2970RB through 1N3015RB and 1N3993A through 1N3998A shall have the cathode
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