MIL-PRF-19500/253L
A- version
NOTES:
.015 x .019 inch �.001 inch. (0.381 X 0.483 �0.0254 mm)
1. Chip size
.010 �.0015 inch. (0.254 �0.038 mm).
2. Chip thickness
3. Top metal
Aluminum 15,000� minimum, 18,000� nominal.
4. Back metal
A. Gold 3,500 � minimum, 5,000 � nominal.
5. Backside
Collector.
6. Bonding pad
B = .003 inch (0.076 mm), E = .004 inch (0.101 mm) diameter.
Si3N4 (Silicon Nitride) 5,600 � min, 8,000 � nom.
7. Passivation
FIGURE 3. Physical dimensions, JANHCA die.
5
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