MIL-PRF-19500/253L
* 4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
Measurement
of MIL-PRF-19500)
JANS levels
JANTX and JANTXV levels
3c
Thermal impedance, method 3131 of
Thermal impedance, method 3131 of
MIL-STD-750, see 4.3.3.
MIL-STD-750, see 4.3.3.
7
Optional.
Optional.
9
ICBO2, hFE2.
Not applicable.
10
48 hours minimum.
48 hours minimum.
11
ICBO2, hFE2
ICBO2, hFE2
ĆICBO2 = 100 percent of initial value or
5 nA dc, whichever is greater;
ĆhFE2 = ±25 percent.
12
See 4.3.1.
See 4.3.1.
13
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICBO2 = 100 percent of initial value or
ĆICBO2 = 100 percent of initial value or
5 nA dc, whichever is greater;
5 nA dc, whichever is greater;
ĆhFE2 = ±25 percent.
ĆhFE2 = ±25 percent.
14
Required
Required
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc. Power shall be
applied to achieve TJ = +135°C minimum using a minimum PD = 75 percent of PT maximum, TA ambient rated as
defined in 1.3. With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias
conditions, TJ, and mounting conditions) may be used. A justification demonstrating equivalence is required. In
addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in
modification approval. This option is limited to plants who are at least transitional (QML) approved or have an
approved technical review board (TRB).
4.3.2 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500, "Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows
JANS requirements; the JANHC follows JANTX requirements.
4.3.3 Thermal impedance (measurements). The thermal impedance measurements shall be performed in
accordance with method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD
(and VC where appropriate). The thermal impedance limit used in 4.3, screen 3c and the subgroup 2 of table I shall
comply with the thermal impedance graph in figures 9, 10, and 11 (less than or equal to the curve value at the same
tH time) and shall be less than the process determined statistical maximum limit as outlined in method 3131 of
MIL-STD-750.
9
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