MIL-PRF-19500/456E
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in tables E-VIa (JANS) and E-VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 and
4.4.2.2 herein. Electrical measurements (end-points) shall be in accordance with the applicable inspections of table I,
subgroup 2 herein.
4.4.2.1 Group B inspection, table E-VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
Condition
VCB = 20 V dc; PD = 5 W at TA = room ambient as defined in 4.5 of MIL-STD-750;
B4
1037
ton = toff = 3 minutes minimum for 2,000 cycles. No heat sink or forced air cooling on
devices shall be permitted.
VCB = 20 V dc; TA = +125C ±25C for 96 hours; PT = 5 W at TA = +125C or
B5
1027
adjusted as required by the chosen TA to give an average lot, TJ = +275C.
4.4.2.2 Group B inspection, table E-VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
For solder die attach: VCB 10 V dc; TA 35C, 2,000 cycles. No heat sink or
B3
1037
forced air cooling on devices shall be permitted.
For eutectic die attach: VCB 10 V dc; TA 35C, adjust PT to achieve
B3
1026
TJ = 175C minimum.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
4.4.3.1. Group C inspection, table E-VII of MIL-PRF-19500.
Method
Conditions
Subgroup
For solder die attach: VCB 10 V dc; TA 35C, 6,000 cycles. No heat sink or
C6
1037
forced air cooling on devices shall be permitted.
For eutectic die attach: VCB 10 V dc; TA 35C, adjust PT to achieve
C6
1026
TJ = 175C minimum.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
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