MIL-PRF-19500/461F
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and table II
herein.
* 4.2.1 JANHC and JANKC qualification. JANHC and JANKC qualification inspection shall be in accordance with
MIL-PRF-19500.
* 4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed by
the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
Thermal impedance
Thermal impedance
(1) 3c
(see 4.3.3)
(see 4.3.3)
hFE1 and ICEX
9
hFE1 and ICEX;
hFE1 and ICEX
11
ΔICEX = ±100 percent
of initial value or 5 μA dc, whichever is
greater.
ΔhFE1 = ±15 percent.
12
Burn-in (see 4.3.1)
Burn-in (see 4.3.1)
Subgroup 2 of table I herein;
13
Subgroups 2 and 3 of table I herein;
ΔICEX = 100 percent of initial value or 0.1
ΔICEX = 100 percent of initial value or 5
μA dc, whichever is greater.
mA dc, whichever is greater.
ΔhFE1 = ±25 percent.
ΔhFE1 = ±15 percent
(1)
Shall be performed anytime after temperature cycling, screen 3a;
and does not need to be repeated in
screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: Method 1039 of MIL-STD-750, test
condition B. TA = room ambient as defined in the general requirements in 4.5 of MIL-STD-750; VCB ≥ 20 V dc,
PT = 3.0 W. NOTE: No heat sink or forced air cooling on the devices shall be permitted.
4.3.2 JANHC and JANKC screening. Screening of die shall be in accordance with MIL-PRF-19500. Test limits
and conditions shall be chosen by the supplier to demonstrate compliance with electrical characteristics specified by
specification. Probe test shall be performed 100 percent by the supplier on the entire die lot.
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