MIL-PRF-19500/463K
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in
MIL-PRF-19500 and as follows:
Pinch-off current. IP Pinch-off current is defined as the regulator current at specified test voltage, VS.
IP
ĆIP
Regulator current variation.
αIP
Temperature coefficient of regulator current.
IS
Pinch-off current. IS Pinch-off current is defined as the regulator current at specified test voltage, VS.
IS is the preferred symbol however IP can still be used.
ĆIS
Regulator current variation.
αIS
Temperature coefficient of regulator current.
L
Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to
the point of lead-temperature measurement. For purposes of this measurement, the same heat
sinking at the same distance from the diode body shall be applied to each lead. No heat sinking shall
occur between the diode body and the point of lead-temperature measurement. This measurement
may be made from either end of the diode body. (The diode body includes slugs, if any, but does not
include braze fillet, paint, etc., within the zone of uncontrollable lead diameter.)
Steady-state power dissipation. Power dissipated under steady-state conditions.
PD
TL
Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path
length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan
thermocouple, or equivalent. All reference to TL is TEC for "UR" devices.
VPOV
Peak operating voltage. Peak operating voltage is the maximum voltage that shall be applied to the
device.
* 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500,
figure 1 (DO-7), figure 2 (DO-213AB), figure 3 (JANHCA and JANKC die), and figure 4 (JANKCB and JANKCB)
herein.
3.5 Dash-one construction. These devices shall be of double plug construction utilizing high temperature
metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond shall be in
accordance with the requirements of category I or II in appendix A of MIL-PRF-19500.
3.5.1 JANS construction. Construction shall be dash-one, category I or II metallurgical bond in accordance with
appendix A of MIL-PRF-19500.
3.5.2 Encapsulant material. In addition to those categories of hermetically sealed package requirements specified
in MIL-PRF-19500, fused-metal-oxide to metal shall also be acceptable.
3.6 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code
shall be marked on the devices. The polarity shall be indicated with a contrasting color band to denote the cathode
end. No color coding shall be permitted. Initial container package marking shall be in accordance with
3.7.1 Marking of UR devices. UR devices shall be marked with a cathode band as a minimum; or a minimum of
three evenly spaced contrasting color dots around the periphery of the cathode end may be used. At the option of
the manufacturer, UR devices may include laser marking on an end-cap, to include part number and lot date code for
all levels. JANS devices which are laser marked shall also include serialization. The prefixes JAN, JANTX, JANTXV,
or JANS may be abbreviated as J, JX, JV, or JS, respectively. (For example: The part number may be reduced to
JS5314). All marking which is omitted from the body of the device shall appear on the initial container. All device
marking, except for polarity and serial numbers, shall also appear on the unit package used as the initial protection
for delivery.
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