MIL-PRF-19500/495G
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles,
n = 22 devices, c = 0
Hermetic seal 4/ 6/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours,
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification) 4/
Subgroup 2
Thermal impedance
72
3131
See 4.3.2
°C/W
ZθJX
Collector to base cutoff current
3036
Bias condition D,
10
µA dc
ICBO1
VCB = 75 V dc
Breakdown voltage, collector to
3011
Bias condition D; IC = 10 mA dc;
40
V dc
V(BR)CEO
emitter
pulsed (see 4.5.1)
10
Emitter to base cutoff current
3061
µA dc
VEB = 6 V dc
IEBO1
Collector to base cutoff current
3036
10
nA dc
Bias condition D; VCB = 50 V dc
ICBO2
10
nA dc
Emitter to base cutoff current
3061
Bias condition D; VEB = 4 V dc
IEBO2
Forward-current transfer ratio
3076
VCE = 10 V dc; IC = 0.1 mA dc
hFE1
2N5793
20
2N5794, 2N5794U, 2N5794UC
35
Forward-current transfer ratio
3076
VCE = 10 V dc; IC = 1.0 mA dc
hFE2
2N5793
25
2N5794, 2N5794U, 2N5794UC
50
See footnotes at end of table.
11
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