MIL-PRF-19500/495G
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table E-VIa (JANS) of MIL-PRF-19500 and 4.4.2.1. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein. See 4.4.2.2 for JAN, JANTX, and JANTXV group B
testing. Electrical measurements (end-points) for JAN, JANTX, and JANTXV shall be after each step in 4.4.2.2 and
shall be in accordance with table I, subgroup 2 herein.
4.4.2.1 Group B inspection (JANS), table E-VIa of MIL-PRF-19500.
Subgroup Method
Condition
B4
1037
VCB = 10 V dc, adjust device current, or power, to achieve a minimum ĆTJ of 100°C.
B5
1027
VCB = 10 V dc; PD ≥ 100 percent of maximum rated PT (see 1.3). (NOTE: If a failure
occurs, resubmission shall be at the test conditions of the original sample.)
Option 1: 96 hours minimum, sample size in accordance with MIL-PRF-19500, table E-VIa,
adjust TA or PD to achieve TJ = +275°C minimum.
Option 2: 216 hours minimum, sample size = 45, c = 0; adjust TA or PD to achieve a
TJ = +225°C minimum.
4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a lot failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during CI, (conformance inspection), shall be analyzed to the extent possible to identify root cause and
corrective action. Whenever a failure is identified as wafer lot or wafer processing related, the entire wafer lot and
related devices assembled from the wafer lot shall be rejected unless an appropriate determined corrective action to
eliminate the failures mode has been implemented and the devices from the wafer lot are screened to eliminate the
failure mode.
Step
Method
Condition
1
1026
Steady-state life: 1,000 hours minimum, VCB = 10 V dc, power shall be applied to achieve
TJ = +150°C minimum using a minimum of PD = 75 percent of maximum rated PT as defined
in 1.3. n = 45 devices, c = 0. The sample size may be increased and the test time
decreased as long as the devices are stressed for a total of 45,000 device hours minimum,
and the actual time of test is at least 340 hours.
Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +175°C. n = 22, c = 0.
3
1032
4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or
from each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection lot.
See MIL-PRF-19500.
b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANTX,
and JANTXV) may be pulled prior to the application of final lead finish.
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